Peak Exotherm. Electrical Insulating And Potting Of Electronic Circuitry. MAX MCR A/B can also be utilized in many different applications where epoxy resins are typically employed. Direct Cast (No Box Enclosure) LED Driver Circuit Board Potting Using Silicone...
MAX BOND MEDIUM VISCOSITY A/B32 Fluid Ounce Kit (Combined Volume)16 ounce PART A -RESIN16 ounce PART B -CURING AGENT EPOXY SYSTEM FOR STRUCTURAL BONDING APPLICATIONS1:1 Mix Ratio 90 Minute Working Time This resin system is epoxy/polyamide-based.The resin/curing agent...
